Packaging of microelectronic devices. Technologies, designs, equipment
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The book presents systematized results of a detailed analysis of the current state and trends in the development of packaging technologies for microchips, semiconductor devices, power modules, and systems in a package. The book is aimed at a fairly wide audience - from students, postgraduates, and teachers of technical universities specializing in microelectronics, to engineers developing microchips and electronic systems based on them, assembly production engineers, employees of research laboratories and academic institutions, and managers of radio-electronic industry enterprises. In eleven thematic chapters, all the main stages of implementing the technological route of the packaging process are sequentially examined using specific examples - from the stage of forming multilevel metallization on the crystal to the hermetization and testing of microelectronic devices. In addition to describing the technological modes, design features, materials used, and modes of conducting technological operations, the book also provides a description of the basic composition and technical characteristics of the technological and measuring equipment used at each stage. For the first time in domestic scientific and technical literature, the theoretical foundations of methods for precision measurement of one of the most important controlled parameters of microchips - thermal resistance - are detailed, including a description of the main experimental methods for its measurement, concepts, methods, tools, and equipment for calibrating test devices in the temperature range. Also, for the first time in domestic scientific and technical literature, modern concepts, technologies, methods, and tools for testing packaged microchips, systems in a package, and systems on a wafer are detailed.
Author:
Author:Belous Anatoliy Ivanovich
Cover:
Cover:hardcover
Category:
- Category:Computer & Technology
- Category:Engineering & Transportation
Dimensions:
Dimensions:24x17.2x3.3 cm
ISBN:
ISBN:978-5-94836-668-5
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